MultiEx® 3D-H2
broadband cleaner for PCBAs especially with large metal surfaces
MultiEx® 3D-H2 is an aqueous, alkaline broadband cleaner for thorough and gentle cleaning of PCBAs, especially PCBAs with large metal surfaces.
MultiEx® 3D-H2 is also suitable for cleaning solder frames, solder carriers and solder masks.
MultiEx® 3D-H2 reliably removes flux residues and metal oxides (e.g. copper or aluminum oxide) and at the same time protects against re-oxidation of the metal surfaces.
MultiEx® 3D-H2 works in three dimensions.
Dimension 1: Flux removal. Flux residues are removed, minimizing the risk of electrical malfunctions due to corrosion.
Dimension 2: Deoxidation of the metal surfaces. Metal oxides are removed so that electrical conductivity is not negatively affected and soldering can be carried out reliably if required.
Dimension 3: Passivation. The deoxidized metal surfaces are passivated so that cleaned and deoxidized metal surfaces remain oxide-free for longer.
MultiEx® 3D-H2 special and unique priming formulation ensures that - without any detectable surface coating - cleaned and deoxidized metal surfaces do not tarnish again.
MultiEx®®3D-H2 is equipped with TernarySequence®® three-phase regeneration technology and TS+ buffer making it even more efficient.
MultiEx® 3D-H2 is supplied as a ready-to-use mixture for direct use in kolb PowerSpray® as well as in all common spray-in-air cleaning systems.
Technical data | |
---|---|
Phases | Single Phase |
pH Value at 20 °C | 10.8 (alkaline) |
Conductance at 20 °C | > 100 µS/cm |
Application temperature | 20 °C - 45 °C |
Regenerable (TS Technology) | |
Flashpoint | > 100 °C |
VOC content | < 20% |
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